Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip
US6750082B2 · kind B2 · utility
33Cited by
9References
58Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2002 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Sep 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of assembling a package having an exposed die comprising the following steps. A die attached to a substrate by connectors is provided. The die having a backside. Encapsulate is formed around the die and over the backside of the die to form an encapsulated package. The encapsulate overlying the backside of the die and a portion of the backside of the die are removed using a backside exposure process to complete the assembled package having the die exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.