Patent · US Expired

Coated heat spreaders

US6751099B2 · kind B2 · utility

17Cited by

7References

15Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Joan K. Vrtis · Mesa, US
Joni G. Hansen · Phoenix, US
Thomas J. Fitzgerald · Phoenix, US
Carl Deppisch · Chandler, US

Key dates

Filing date	Dec 20, 2001
Grant date	Jun 15, 2004
Priority date	—
Expiry date	Dec 20, 2021

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49155
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.