Patent · US Expired

Apparatus for and method of wafer grinding

US6752694B2 · kind B2 · utility

9Cited by

14References

18Claims

0Family size

Assignees

Motorola, Inc. · US
Semiconductor 300 GmbH & Co. KG · DE
Infineon Technologies AG · DE

Inventors

Manfred Schneegans · Vaterstetten, DE
Michael Roesner · Villach, AT
David Wallis · Cambridge, GB

Key dates

Filing date	Nov 8, 2002
Grant date	Jun 22, 2004
Priority date	—
Expiry date	Nov 8, 2022

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B49/16
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An apparatus (10) for wafer grinding includes sensors (38) and a spectral analyzer to perform a spectral analysis of light received by the sensors (38) during grinding of a semiconductor wafer (12). Based on the spectral analysis, the grinding process is stopped or the force applied to the semiconductor wafer is modified. This in situ monitoring decreases breakage and overheating of the semiconductor wafer (12).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.