Ultraviolet curing processes for advanced low-k materials
US6756085B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2003 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Jul 21, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02216
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Low dielectric constant materials with improved elastic modulus and material hardness. The process of making such materials involves providing a dielectric material and ultraviolet (UV) curing the material to produce a UV cured dielectric material. UV curing yields a material with improved modulus and material hardness. The improvement is each typically greater than or about 50%. The UV cured dielectric material can optionally be post-UV treated. The post-UV treatment reduces the dielectric constant of the material while maintaining an improved elastic modulus and material hardness as compared to the UV cured dielectric material. UV cured dielectrics can additionally exhibit a lower total thermal budget for curing than for furnace curing processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.