Stacked dice bonded with aluminum posts
US6756305B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 1, 2003 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Apr 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die assembly contains multiple stacked dice bonded together by a large number of metal posts. A first die has a plurality of metal posts oriented orthogonally to a planar surface of the first die. The metal posts protrude from the first die out beyond the surface. Similarly, a second die also has a plurality of metal posts protruding from a surface. The first die is coupled to the second die in an oxygen-free atmosphere such that each protruding metal post of the first die contacts a protruding metal post of the second die. By applying pressure, cold welds are formed between corresponding metal posts of the first and second dice. The first die and the second die are held together by the metal posts without an adhesive. In one embodiment, some of the metal posts do not conduct signals between the first and second dice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.