Inventor · Hakalau, HI, US

Robert O. Conn

71Patents
24h-index
31Co-inventors
84Inventor score

Filing activity: Oct 16, 1995 → Aug 7, 2013

Most-cited inventions

PatentTitleAreaCited byStatus
US6864156B1 Semiconductor wafer with well contacts on back side Electricity 318 Expired
US7068072B2 Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit Electricity 299 Expired
US6002991A Method and apparatus for measuring localized voltages on programmable integrated circuits Physics 128 Expired
US7064391B1 Bond and back side etchback transistor fabrication process Emerging Cross-Sectional Technologies 89 Expired
US6882182B1 Tunable clock distribution system for reducing power dissipation Electricity 64 Expired
US5811985A Output multiplexer circuit for input/output block Electricity 63 Expired
US5790479A Method for characterizing interconnect timing characteristics using reference ring oscillator circuit Physics 62 Expired
US6875921B1 Capacitive interposer Electricity 58 Expired
US6219305A Method and system for measuring signal propagation delays using ring oscillators Physics 53 Expired
US7098689B1 Disabling unused/inactive resources in programmable logic devices for static power reduction Electricity 51 Expired
US6150863A User-controlled delay circuit for a programmable logic device Electricity 51 Expired
US6945712B1 Fiber optic field programmable gate array integrated circuit packaging Electricity 49 Expired
US5594367A Output multiplexer within input/output circuit for time multiplexing and high speed logic Electricity 46 Expired
US7233061B1 Interposer for impedance matching Electricity 41 Expired
US6233205A Built-in self test method for measuring clock to out delays Physics 39 Expired
US6005829A Method for characterizing interconnect timing characteristics Physics 38 Expired
US7581124B1 Method and mechanism for controlling power consumption of an integrated circuit Physics 34 Active
US7566960B1 Interposing structure Emerging Cross-Sectional Technologies 32 Expired
US7084487B1 Shielded platform for die-bonding an analog die to an FPGA Electricity 32 Expired
US8062968B1 Interposer for redistributing signals Emerging Cross-Sectional Technologies 30 Active
US6961231B1 Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit Electricity 28 Expired
US6891258B1 Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit Electricity 28 Expired
US6756305B1 Stacked dice bonded with aluminum posts Electricity 26 Expired
US6356514B1 Built-in self test method for measuring clock to out delays Physics 25 Expired
US6069849A Method and system for measuring signal propagation delays using the duty cycle of a ring oscillator Physics 24 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.