Method of installing a land grid array multi-chip modules
US6757965B2 · kind B2 · utility
8Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2003 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Jun 5, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.