Methods for determination of additive concentration in metal plating baths
US6758955B2 · kind B2 · utility
3Cited by
2References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 6, 2002 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Dec 6, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/205
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to PCGA analytical procedure, in which each PCGA plating/measuring cycle is performed with the stripping and cleaning of test electrode immediately conducted before the equilibrium step, so as to use the metal plate layer formed during a previous plating/measuring cycle as a protective layer for the test electrode. The present invention also relates to PCGA calibration measurement protocol, in which both the calibration measurements and the sample measurement are conducted after a background measurement step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.