Single unit automated assembly of flex enhanced ball grid array packages
US6759752B2 · kind B2 · utility
6Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2003 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Feb 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package is provided for the mounting of IC devices. The IC die is bonded to metal traces contained in a flexible tape, the IC die with the flexible tape is attached to a stiffener (heat spreader), the various heat conducting interfaces are cured and solder balls are attached to another surface of the flexible tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.