Heat sink with alignment and retaining features
US6760224B2 · kind B2 · utility
38Cited by
61References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2003 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Feb 25, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24298
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.