Method of preventing solder wetting in an optical device using diffusion of Cr
US6762119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2001 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Jun 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0235
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process and structure for forming an optical subassembly in an integrated circuit, comprising: defining electrically conducting lines and bonding pads in a metallization layer on a substrate; depositing a passivation layer over the metallization layer; etching the passivation layer to remove the passivation layer from each of the bonding pads and a portion of the metallization layer associated with each of the bonding pads; diffusing Cr from the lines proximate said bonding pads to prevent solder wetting down lines; bonding an optical device to one of the bonding pads; and attaching the substrate to a carrier utilizing solder bond attachment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.