Electronic package having high density signal wires with low resistance
US6762367B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2002 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Sep 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In the present invention an electronic package assembly includes an integrated circuit positioned on a substrate. The substrate has substantially horizontal layers including horizontal signal wires having vertical thicknesses and resistance. In a preferred embodiment, first and second vertical thicknesses of the signal wires alternate from the top to the bottom of the substrate such that the signal wires with greater vertical thicknesses have lower resistance than the signal wires would typically have. A plurality of substantially vertical conductive vias traverse the horizontal layers such that the vertical conductive vias connect to the integrated circuit and connect with at least one of the horizontal signal wires. A circuit board positioned beneath the substrate includes connection members for connecting with, and terminating the vertical conductive vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.