N-p butting connections on SOI substrates

US6762464B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Clair Webb · Beaverton, US
• Mark Bohr · Beaverton, US

Key dates

• Filing date: Sep 17, 2002
• Grant date: Jul 13, 2004
• Expiry date: Sep 17, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D86/201

Abstract

An SOI connection for connecting source/drain regions of one transistor to source/drain regions of another transistor without the use of overlying metal. The regions abut, and a salicide interconnects the regions.