Polishing apparatus
US6764381B2 · kind B2 · utility
6Cited by
27References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2003 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Mar 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.