Wafer polishing method and wafer polishing device
US6764392B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2001 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Dec 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a polishing turn table, the wafer is held by vacuum-chucking the surface to be polished of the wafer such that a surface to be adhered of the wafer forms a convex surface in a vicinity including an arbitrary point in the surface to be adhered within a region surrounding a center of the surface to be adhered of the wafer, and the region being at least not less than 50% of an entire adhesion area; and the wafer is adhered to the wafer holding plate from a central portion of the surface to be adhered of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.