Takashi Nihonmatsu
7Patents
4h-index
10Co-inventors
54Inventor score
Filing activity: Sep 13, 1977 → Aug 16, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4168437A | Optoelectric multi-sensor measuring apparatus and a method for measuring surface flatness therewith | Physics | 38 | Expired |
| US6239039A | Semiconductor wafers processing method and semiconductor wafers produced by the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7332437B2 | Method for processing semiconductor wafer and semiconductor wafer | Electricity | 5 | Expired |
| US6080641A | Method of manufacturing semiconductor wafer | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6432837B1 | Semiconductor wafer processing method and semiconductor wafers produced by the same | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6346485B1 | Semiconductor wafer processing method and semiconductor wafers produced by the same | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6764392B2 | Wafer polishing method and wafer polishing device | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.