Patent · US Expired

Micro-relay

US6765300B1 · kind B1 · utility

4Cited by

4References

45Claims

0Family size

Assignees

Tyco Electronics Logistics AG · CH
Institute of Microelectronics · SG

Inventors

Dirk Wagenaar · Singapore, SG
Kay Krupka · Berlin, DE
Helmut Schlaak · Ober-Ramstadt, DE
Uppili Sridhar · Singapore, SG
Victor Donald Samper · Kirchseeon, DE
Pang Dow Foo · Singapore, SG

Key dates

Filing date	Feb 11, 2002
Grant date	Jul 20, 2004
Priority date	—
Expiry date	Feb 11, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A microstructure relay is provided, having a body that includes upper and lower portions. The lower portion is formed from a substrate, and the upper portion is formed on the substrate to avoid bonding of the lower portion to the upper portion. A support member is fixed to the body at a first end of the support member to form a cantilever, wherein an upper surface of the support member and a lower surface of the upper portion of the body form a cavity. A first contact region is located on the upper surface at a second end of the support member. The first contact region comprises a first contact, wherein pivoting the support member toward the lower surface causes the first contact to be electrically coupled to a counter contact.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.