Method of manufacturing a semiconductor device in which a block molding package utilizes air vents in a substrate
US6767767B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 16, 2002 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Jul 16, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device manufacturing method is disclosed which can reduce the cost of manufacturing an MAP type semiconductor device. According to this method, a substrate with semiconductor chips mounted at predetermined intervals in a matrix shape on a main surface thereof is clamped between a lower mold and an upper mold of a molding die, an insulating resin is injected through gates into a cavity formed on the main surface side of the substrate, air present within the cavity is allowed to escape from air vents, to form a block molding package which covers the semiconductor chips, thereafter bump electrodes are formed on a back surface of the substrate, and then the block molding package and the substrate are cut longitudinally and transversely to fabricate plural semiconductor devices. The air vents are formed by grooves provided in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.