Semiconductor device and laminated leadframe package
US6768186B2 · kind B2 · utility
11Cited by
15References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2002 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Oct 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An semiconductor device (100) comprising a first semiconductor die (120) and a leadframe (200). The leadframe includes a first laminate (210) having a bottom surface formed with a lead (220) of the semiconductor device, a second laminate (230) overlying the first laminate for mounting the semiconductor die, and an adhesive tape (250) for attaching the first and second laminates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.