Electronic component with stacked electronic elements

US6768191B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Ingo Wennemuth · Munich, DE
• Jochen Thomas · Munich, DE

Key dates

• Filing date: Aug 12, 2002
• Grant date: Jul 27, 2004
• Expiry date: Sep 11, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/302
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

An electronic component includes stacked electronic elements with external contacts. The external contacts are connected to contact terminal pads of an interconnect layer disposed on an isolating body. This isolating body extends over underlying side edges of a further electronic element, and its interconnect layer is connected to another interconnect layer of the stack via its external contact surfaces.