Jochen Thomas
19Patents
10h-index
21Co-inventors
64Inventor score
Filing activity: Jun 17, 2002 → May 6, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7297574B2 | Multi-chip device and method for producing a multi-chip device | Electricity | 282 | Expired |
| US6894381B2 | Electronic device having a stack of semiconductor chips and method for the production thereof | Electricity | 57 | Expired |
| US7456505B2 | Integrated circuit chip and integrated device | Electricity | 18 | Expired |
| US6927484B2 | Stack arrangement of a memory module | Electricity | 15 | Expired |
| US7422930B2 | Integrated circuit with re-route layer and stacked die assembly | Electricity | 14 | Expired |
| US7402911B2 | Multi-chip device and method for producing a multi-chip device | Electricity | 13 | Expired |
| US7294910B2 | Electronic component with multilayered rewiring plate and method for producing the same | Electricity | 13 | Expired |
| US7352057B2 | Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module | Electricity | 11 | Expired |
| US7948071B2 | Integrated circuit with re-route layer and stacked die assembly | Electricity | 10 | Active |
| US6768191B2 | Electronic component with stacked electronic elements | Electricity | 10 | Expired |
| US7198979B2 | Method for manufacturing a stack arrangement of a memory module | Electricity | 7 | Expired |
| US6536682B1 | Actuator component for a microspray and its production process | Performing Operations; Transporting | 6 | Expired |
| US7851899B2 | Multi-chip ball grid array package and method of manufacture | Electricity | 6 | Expired |
| US6977427B2 | Electronic component having stacked semiconductor chips in parallel, and a method for producing the component | Electricity | 5 | Expired |
| US8624372B2 | Semiconductor component comprising an interposer substrate | Electricity | 5 | Active |
| US7253514B2 | Self-supporting connecting element for a semiconductor chip | Electricity | 3 | Expired |
| US8072085B2 | Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same | Electricity | 1 | Active |
| US7023097B2 | FBGA arrangement | Electricity | 1 | Expired |
| US7345363B2 | Semiconductor device with a rewiring level and method for producing the same | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.