Method and system for slurry usage reduction in chemical mechanical polishing
US6769959B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2002 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Aug 11, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system is disclosed for reducing slurry usage in a chemical mechanical polishing operation utilizing at least one polishing pad thereof. Slurry can be intermittently supplied to a chemical mechanical polishing device. The slurry is generally flushed so that a portion of said slurry is trapped in a plurality of pores of at least one polishing pad associated with said chemical mechanical polishing device, wherein only a minimum amount of said slurry necessary is utilized to perform said chemical mechanical polishing operation, thereby reducing slurry usage and maintaining a consistent level of slurry removal rate performance and a decrease in particle defects thereof. The present invention thus discloses a method and system for intermittently delivering slurry to a chemical mechanical polishing device in a manner that significantly conserves slurry usage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.