Inventor · Tainan, TW

Kuo-Hsiu Wei

22Patents
4h-index
34Co-inventors
63Inventor score

Filing activity: Jan 9, 2002 → Jun 7, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6828226B1 Removal of SiON residue after CMP Electricity 15 Expired
US9570311B2 Modular grinding apparatuses and methods for wafer thinning Performing Operations; Transporting 6 Active
US9064770B2 Methods for minimizing edge peeling in the manufacturing of BSI chips Electricity 5 Active
US9676114B2 Wafer edge trim blade with slots Emerging Cross-Sectional Technologies 4 Active
US6769959B2 Method and system for slurry usage reduction in chemical mechanical polishing Performing Operations; Transporting 3 Expired
US10643892B2 Metal loss prevention using implantation Electricity 2 Active
US10643853B2 Wafer thinning apparatus having feedback control and method of using Electricity 1 Active
US9931726B2 Wafer edge trimming tool using abrasive tape Performing Operations; Transporting 1 Active
US11211289B2 Metal loss prevention using implantation Electricity 1 Active
US9339912B2 Wafer polishing tool using abrasive tape Performing Operations; Transporting 1 Active
US9829806B2 Lithography tool with backside polisher Physics 0 Active
US10957587B2 Structure and formation method of semiconductor device with conductive feature Electricity 0 Active
US11482450B2 Methods of forming an abrasive slurry and methods for chemical- mechanical polishing Electricity 0 Active
US11728172B2 Wafer thinning apparatus having feedback control Electricity 0 Active
US10937691B2 Methods of forming an abrasive slurry and methods for chemical-mechanical polishing Electricity 0 Active
US11710659B2 Metal loss prevention using implantation Electricity 0 Active
US11532514B2 Structure and formation method of semiconductor device with conductive feature Electricity 0 Active
US12068195B2 Metal loss prevention using implantation Electricity 0 Active
US9566683B2 Method for wafer grinding Performing Operations; Transporting 0 Active
US9721984B2 Image sensor manufacturing methods Electricity 0 Active
US8049213B2 Feature dimension measurement Electricity 0 Active
US9120194B2 Apparatus for wafer grinding Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.