Workpiece holder for polishing, polishing apparatus and polishing method
US6769966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2001 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Aug 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a workpiece holder for polishing comprising at least a workpiece holder body having multiple perforated holes for holding a workpiece by vacuum adsorption and a back plate disposed on the back side of the body, which is provided with temperature controlling means or cooling means for the holder body. Thus, there is provided a workpiece holder for polishing, a polishing apparatus and a polishing method, which can provide a workpiece having good flatness by suppressing thermal deformation of the workpiece holder body and deformation of a resin film coated on the workpiece holding surface without degrading flatness of a workpiece held on the workpiece holder in the polishing of the workpiece, even when the number of polishing operation increases.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.