Method and system for rotating a semiconductor wafer in processing chambers
US6770146B2 · kind B2 · utility
29Cited by
31References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2001 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Feb 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is generally directed to a system and process for rotating semiconductor wafers in thermal processing chambers, such as rapid thermal processing chambers and chemical vapor deposition chambers. In accordance with the present invention, a semiconductor wafer is supported on a substrate holder which, in turn, is supported on a rotor. During processing, the rotor is magnetically levitated and magnetically rotated by suspension actuators and rotation actuators positioned outside of the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.