Die used for resin-sealing and molding an electronic component
US6773247B1 · kind B1 · utility
14Cited by
1References
11Claims
0Family size
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Inventors
Key dates
| Filing date | Nov 2, 2000 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Jun 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.