Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources
US6773571B1 · kind B1 · utility
95Cited by
14References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2002 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | May 22, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention pertains to methods and apparatus for electroplating a substantially uniform layer of a metal onto a work piece having a seed layer thereon. The total current of a plating cell is distributed among a plurality of anodes in the plating cell in order to tailor the current distribution in the plating electrolyte to compensate for resistance and voltage variation across a work piece due to the seed layer. Focusing elements are used to create “virtual anodes” in proximity to the plating surface of the work piece to further control the current distribution in the electrolyte during plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.