Evan E. Patton
39Patents
25h-index
42Co-inventors
85Inventor score
Filing activity: Jun 2, 1988 → Oct 17, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6156167A | Clamshell apparatus for electrochemically treating semiconductor wafers | Electricity | 250 | Expired |
| US6074544A | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer | Emerging Cross-Sectional Technologies | 203 | Expired |
| US6099702A | Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability | Chemistry; Metallurgy | 157 | Expired |
| US6139712A | Method of depositing metal layer | Electricity | 152 | Expired |
| US6162344A | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer | Emerging Cross-Sectional Technologies | 152 | Expired |
| US6527920B1 | Copper electroplating apparatus | Electricity | 147 | Expired |
| US6159354A | Electric potential shaping method for electroplating | Chemistry; Metallurgy | 146 | Expired |
| US6800187B1 | Clamshell apparatus for electrochemically treating wafers | Chemistry; Metallurgy | 141 | Expired |
| US6110346A | Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer | Emerging Cross-Sectional Technologies | 131 | Expired |
| US6402923B1 | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element | Emerging Cross-Sectional Technologies | 102 | Expired |
| US6773571B1 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources | Chemistry; Metallurgy | 95 | Expired |
| US6309981A | Edge bevel removal of copper from silicon wafers | Electricity | 91 | Expired |
| US6551487B1 | Methods and apparatus for controlled-angle wafer immersion | Emerging Cross-Sectional Technologies | 87 | Expired |
| US6193859A | Electric potential shaping apparatus for holding a semiconductor wafer during electroplating | Chemistry; Metallurgy | 74 | Expired |
| US6964792B1 | Methods and apparatus for controlling electrolyte flow for uniform plating | Chemistry; Metallurgy | 73 | Expired |
| US6890416B1 | Copper electroplating method and apparatus | Electricity | 67 | Expired |
| US6755946B1 | Clamshell apparatus with dynamic uniformity control | Chemistry; Metallurgy | 42 | Expired |
| US6436249B1 | Clamshell apparatus for electrochemically treating semiconductor wafers | Electricity | 39 | Expired |
| US6589401B1 | Apparatus for electroplating copper onto semiconductor wafer | Electricity | 39 | Expired |
| US6946065B1 | Process for electroplating metal into microscopic recessed features | Electricity | 34 | Expired |
| US4994400A | Method of fabricating a semiconductor device using a tri-layer structure and conductive sidewalls | Emerging Cross-Sectional Technologies | 31 | Expired |
| US7033465B1 | Clamshell apparatus with crystal shielding and in-situ rinse-dry | Chemistry; Metallurgy | 29 | Expired |
| US5029117A | Method and apparatus for active pyrometry | Physics | 28 | Expired |
| US6471845B1 | Method of controlling chemical bath composition in a manufacturing environment | Emerging Cross-Sectional Technologies | 26 | Expired |
| US7189647B2 | Sequential station tool for wet processing of semiconductor wafers | Electricity | 25 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.