pH buffered compositions useful for cleaning residue from semiconductor substrates
US6773873B2 · kind B2 · utility
65Cited by
22References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2002 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Mar 25, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A semi-aqueous cleaning formulation useful for removing particles from semiconductor wafer substrates formed during a dry etching process for semiconductor devices, the cleaning formulation comprising a buffering system a polar organic solvent, and a fluoride source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.