Semiconductor device and manufacturing method thereof
US6774494B2 · kind B2 · utility
116Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 23, 2001 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Aug 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes an inner lead, a first ball on the inner lead, a bonding pad on the semiconductor device, a second ball on the bonding pad, and a bonding wire connecting the first and second balls. The second ball is formed by mechanically deforming the bonding wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.