Flip-chip assembly with thin underfill and thick solder mask
US6774497B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2003 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Mar 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a method for attaching a flip chip to an electrical substrate such as a printed wiring board. A bumped flip chip is provided, the flip chip including an active surface and a plurality of connective bumps extending from the active surface, each connective bump including a side region. A thin layer of an underfill material is applied to the active surface of the flip chip and to a portion of the side regions of the connective bumps. The flip chip is positioned on the electrical substrate, the electrical substrate including a thick layer of a solder mask disposed on the electrical substrate. The flip chip is heated to electrically connect the flip chip to the electrical substrate, wherein the underfill material and the solder mask combine to form a stress-relief layer when the flip chip is electrically connected to the electrical substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.