Semiconductor-device inspecting apparatus and a method for manufacturing the same
US6774654B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2002 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Dec 12, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor inspecting apparatus having a plurality of electrical connection boards arranged in the inspecting apparatus and a plurality of probes respectively provided on a plurality of beams formed on a first board of said plurality of electrical connection boards, the probes being adapted to be individually brought into contact with a plurality of electrode pads of a semiconductor device for inspection, so as to inspect the semiconductor device while establishing electrical connection therebetween. A one-end supported beam is used as each of the beams, and each of the probes is formed at a portion shifted in a rectangular direction to a center line of a longitudinal direction of the one-end supported beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.