Process of removing holefill residue from a metallic surface of an electronic substrate
US6776852B2 · kind B2 · utility
0Cited by
21References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 14, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Jan 3, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process of removing excess holefill material from a surface of an electronic substrate in which the holefill residue is contacted with a swelling agent followed by planarizing of the surface in the presence of an agent no stronger than a liquid having a pH of about 6 to about 8.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.