Apparatus and methods for determining floating body effects in SOI devices
US6777708B1 · kind B1 · utility
10Cited by
11References
29Claims
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Assignee
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Key dates
| Filing date | Jan 15, 2003 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Mar 19, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/3016
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems are described for determining floating body delay effects in an SOI wafer, wherein test apparatus is provided in a wafer comprising a plurality of floating body devices fabricated in series in the wafer, and a pulse generation circuit providing a pulse output corresponding to a delay time associated with the floating body chain according to an input pulse edge and a propagated pulse edge from the floating body devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.