Interposer for electrically coupling a semiconductive device to an electrical apparatus
US6777965B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 28, 1998 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Jul 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interposer for electrically coupling a semiconductive device to an electrical apparatus includes (i) a substrate comprised of an electrically insulating, thermally conductive ceramic material; and (ii) an electrical conductor on the substrate having a receiving end for connecting to a semiconductive device and a terminal end for connecting to an electrical apparatus. The semiconductive device is electrically coupled to the electrical apparatus when the semiconductive device is connected to the receiving end of the electrical conductor and the terminal end of the electrical conductor is connected to the electrical apparatus. A thermally conductive connector connects the semiconductive device to the interposer. The thermally conductive interposer and connector conduct heat from the semiconductive device to the environment, thereby protecting the semiconductive device from overheating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.