Resilient contact structures for interconnecting electronic devices
US6778406B2 · kind B2 · utility
194Cited by
56References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2000 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Apr 10, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49213
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Resilient contact structures provide electrical interconnection between a semiconductor die and another electronic component. Multilayered packaging may be formed on the semiconductor die, and the resilient contact structures may be formed on portions of one or more of the layers. Heat dissipating structures may be provided on the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.