Patent · US Expired

Method and apparatus for detecting topographical features of microelectronic substrates

US6779386B2 · kind B2 · utility

8Cited by
5References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 30, 2001
Grant dateAug 24, 2004
Priority date
Expiry dateFeb 1, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49004
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

An apparatus and method for detecting characteristics of a microelectronic substrate. The microelectronic substrate can have a first surface with first topographical features, such as roughness elements, and a second surface facing opposite from the first surface and having second topographical features, such as protruding conductive structures. In one embodiment, the apparatus can include a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed. The apparatus can further include a topographical feature detector positioned proximate to support member and aligned with the first portion of the first surface of the microelectronic substrate to detect characteristics, such as a roughness, of the first surface while the microelectronic substrate is carried by the support member.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.