Polishing tool used for CMP
US6780092B2 · kind B2 · utility
1Cited by
6References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 19, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Apr 19, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/061
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing tool used for a CMP process is disclosed. The polishing tool includes a polishing platen for holding a wafer faced-up thereon and carrying the wafer to move to and fro between a first position and a second position, a polishing pad for polishing the wafer, and a holder for holding the polishing pad to self-rotate and carrying the polishing pad to move across the wafer surface and further driving the polishing pad to polish the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.