Champion Yi
10Patents
7h-index
11Co-inventors
55Inventor score
Filing activity: Sep 4, 1996 → Apr 19, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6153116A | Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation | Performing Operations; Transporting | 55 | Expired |
| US6432728B1 | Method for integration optimization by chemical mechanical planarization end-pointing technique | Electricity | 33 | Expired |
| US5776833A | Method for forming metal plug | Electricity | 20 | Expired |
| US6461226B1 | Chemical mechanical polishing of a metal layer using a composite polishing pad | Performing Operations; Transporting | 13 | Expired |
| US6227949A | Two-slurry CMP polishing with different particle size abrasives | Performing Operations; Transporting | 11 | Expired |
| US6146260A | Polishing machine | Performing Operations; Transporting | 8 | Expired |
| US6130163A | Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by adjustment of PH of deionized water | Performing Operations; Transporting | 8 | Expired |
| US6238279A | Magnetic filtration for slurry used in chemical mechanical polishing of semiconductor wafers | Performing Operations; Transporting | 7 | Expired |
| US6053802A | Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by megasonic pulse | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6780092B2 | Polishing tool used for CMP | Performing Operations; Transporting | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.