Low contamination components for semiconductor processing apparatus and methods for making components
US6780787B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Mar 21, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Components of semiconductor processing apparatus are formed at least partially of erosion, corrosion and/or corrosion-erosion resistant ceramic materials. Exemplary ceramic materials can include at least one oxide, nitride, boride, carbide and/or fluoride of hafnium, strontium, lanthanum oxide and/or dysprosium. The ceramic materials can be applied as coatings over substrates to form composite components, or formed into monolithic bodies. The coatings can protect substrates from physical and/or chemical attack. The ceramic materials can be used to form plasma exposed components of semiconductor processing apparatus to provide extended service lives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.