Apparatus and method for testing semiconductor devices
US6783316B2 · kind B2 · utility
1Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2001 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Oct 18, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides apparatus for supporting during a testing operation a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus comprises a main body and a leadframe support member, and the leadframe support member is formed with at least one groove for receiving semiconductor devices such that in use leads extending from said devices lie on a surface of said support member. The invention also relates to a system for transporting devices to and from a test probe head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.