Reticle defect printability verification by resist latent image comparison
US6784446B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2002 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Apr 4, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/95692
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
One aspect of the present invention relates to a system and method for detecting defects on a reticle by inspecting latent images printed on a resist wafer by the reticle. The system includes a wafer having a printed photoresist layer formed thereon, a latent image inspection system connected to the wafer exposure system for examining the printed photoresist layer in order to determine whether a reticle employed to print the photoresist layer is defective, and a processor for receiving data from the inspection system in order to verify the presence of defects on the reticle. The method involves printing a first latent image, a second latent image, and a third latent image on a resist wafer using a reticle, and comparing the three latent images to one another to determine whether the reticle is defective. Comparison of the latent images may be facilitated by employing an optical system programmed to perform such comparisons.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.