Patent · US Expired

Methods of forming hafnium-containing materials, methods of forming hafnium oxide, and capacitor constructions comprising hafnium oxide

US6785120B1 · kind B1 · utility

16Cited by
3References
61Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 3, 2003
Grant dateAug 31, 2004
Priority date
Expiry dateJul 3, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/601
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention includes methods of forming hafnium-containing materials, such as, for example, hafnium oxide. In one aspect, a semiconductor substrate is provided, and first reaction conditions are utilized to form hafnium-containing seed material in a desired crystalline phase and orientation over the substrate. Subsequently, second reaction conditions are utilized to grow second hafnium-containing material over the seed material. The second hafnium-containing material is in a crystalline phase and/or orientation different from the crystalline phase and orientation of the hafnium-containing seed material. The second hafnium-containing material can be, for example, in an amorphous phase. The seed material is then utilized to induce a desired crystalline phase and orientation in the second hafnium-containing material. The invention also includes capacitor constructions utilizing hafnium-containing materials, and circuit assemblies comprising the capacitor constructions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.