Method of making a semiconductor having multi-layered electrodes including nickel and phosphorus and solder formed with tin and an alkaline earth metal
US6787442B2 · kind B2 · utility
8Cited by
7References
4Claims
0Family size
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Key dates
| Filing date | Feb 5, 2003 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Feb 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
By a solder bump, a CSP is bonded to a first electrode of the module substrate of a multi-chip module. For this solder bump, a solder added with an alkaline earth metal such as Ba, Be, Ca or Mg is used. Accordingly, upon solder reflow, phosphorous (P) reacts with the alkaline earth metal, thereby forming a P compound. Owing to dispersion of this P compound inside of the solder bump, no P concentrated layer is formed on the Ni film, making it possible to prevent peeling of the solder bump from the first electrode upon solder reflow. Thus, the present invention makes it possible to improve the solder bonding property.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.