Substrate processing apparatus and substrate processing method
US6790681B2 · kind B2 · utility
3Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Jun 22, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/905
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In this invention, a time period taken with a wafer W to be transferred to the heat processing apparatus in the post exposure baking unit through the out stage in the aligner, the wafer transfer mechanism, the transition unit, the wafer transfer mechanism, and the temperature regulation and transfer apparatus in the post exposure baking unit is controlled to be approximately constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.