Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor
US6791169B2 · kind B2 · utility
4Cited by
41References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 25, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Jul 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic package includes first and second microelectronic elements in spaced-apart relationship which are electrically interconnected by a plurality of flexible leads and a layer of anisotropic conductive material. The flexible leads having one end attached to terminals on one of the microelectronic elements extends away therefrom having its opposite tip end electrically interconnected to contacts on the other microelectronic element by virtue of an interposed layer of the anisotropic conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.