Structure and process for reducing die corner and edge stresses in microelectronic packages
US6794223B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2003 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Jun 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar to that of silicon, is attached to the back side of the die using a heat-conducting adhesive. An epoxy-based material is flowed into the gap between the die, the substrate, and the heat spreader via a through-hole in either the substrate or the heat spreader using a dispense process or a transfer molding process. By positioning the heat spreader to abut the die corners and/or edges, the stresses on the die are substantially reduced or eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.