Apparatus for the application of developing solution to a semiconductor wafer
US6796517B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2000 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Mar 9, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A wedge-shaped nozzle for dispensing fluids onto a round surface is disclosed. The nozzle dispenses the fluid with a generally uniform volume of fluid per unit area of the round surface to achieve rapidly a uniform thickness of applied fluid on the round surface. The wedge-shaped nozzle has orifices of equal size disposed on its bottom through which the fluid is dispensed. The orifices are disposed along arcs, with increasing numbers of orifices on the arcs at greater and greater distances of the arcs from the apex of the wedge-shaped nozzle. The numbers of the orifices on each arc are proportional to the area of an annular region determined by the arcs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.