Connection of packaged integrated memory chips to a printed circuit board
US6798051B2 · kind B2 · utility
1Cited by
3References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Jul 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interface unit and a printed circuit board configuration includes at least two interface units for linking conventional commercially available packages of integrated circuits on a printed circuit board in a more flexible and compact way, which allows compact high-performance electronic circuits to be produced on a small surface area and with low development expenditure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.