Clamshell apparatus for electrochemically treating wafers
US6800187B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2001 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Mar 12, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/004
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for engaging a work piece during plating facilitates electrolyte flow during a plating operation. The apparatus helps to control the plating solution fluid dynamics and electric field shape to keep the wafer's local plating environment uniform and bubble free. The apparatus holding the work piece in a manner that facilitates electrolyte circulation patterns in which the electrolyte flows from the center of the work piece plating surface, outward toward the edge of the edge of the work piece. The apparatus holds the work piece near the work piece edges and provides a flow path for electrolyte to flow outward away from the edges of the work piece plating surface. That flow path has a “snorkel” shape in which the outlet is higher than the inlet. In addition, the flow path may have a slot shape that spans much or all of the circumference of holding apparatus. It may be made from a material that resists deformation and corrosion such as certain ceramics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.